Manufacturer: NXP USA Inc.
Categories: Microcontrollers
Quality Control: Learn More
Packaging | Tray |
Package / Case | 360-BBGA |
Mounting Type | Surface Mount |
Speed | 200MHz |
Program Memory Size | - |
RAM Size | 32K x 8 |
Operating Temperature | -40°C ~ 85°C (TA) |
Oscillator Type | Internal |
Program Memory Type | ROMless |
EEPROM Size | - |
Core Processor | ColdFire V4 |
Data Converters | - |
Core Size | 32-Bit Single-Core |
Voltage - Supply (Vcc/Vdd) | 1.35V ~ 3.6V |
Connectivity | I2C, SPI, SSI, UART/USART, USB OTG |
Peripherals | DMA, WDT |
Supplier Device Package | 360-TEPBGA (23x23) |
Number of I/O | 132 |
Programmable | Not Verified |